Composition for forming silica layer, manufacturing method for silica layer, and silica layer
US11518909B2 · kind B2 · utility
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2References
12Claims
0Family size
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Key dates
| Filing date | Feb 13, 2018 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Feb 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30604
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.