Fluid composition and method for conducting a material removing operation
US11518913B2 · kind B2 · utility
0Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Aug 27, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B35/127
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fluid composition suitable for chemical mechanical polishing a substrate can in include a multi-valent metal borate, at least one oxidizer, and a solvent. The fluid composition can be essentially free of abrasive particles and may achieve a high material removal rate and excellent surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.