Patent · US Active

Pressure sensitive adhesive assembly comprising filler material

US11518914B2 · kind B2 · utility

0Cited by

11References

10Claims

0Family size

Assignee

3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

Jan Heimink · Schwelm, DE
Kerstin Unverhau · Neuss, DE
Jan D. Forster · Essen, DE
Jan U. Wieneke · Düsseldorf, DE
Frank Kuester · Düsseldorf, DE
Siegfried R. Goeb · Willich, DE
Doreen Eckhardt · Dormagen, DE
Regina Sikora · Neuss, DE
Ruchi Pandey · Bengaluru, IN
Suresh S. Iyer · Woodbury, US

Key dates

Filing date	May 13, 2014
Grant date	Dec 6, 2022
Priority date	—
Expiry date	Sep 18, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2433/00
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The present disclosure relates to a pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer comprising a hollow non-porous particulate filler material, wherein the surface of the hollow non-porous particulate filler material is provided with a hydrophobic surface modification. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.