Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements
US11519881B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jul 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/102
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for ultrasonic testing of adhesion within a sample, which provides ultrasonic bursts of different frequencies to the sample and maintains a predetermined phase difference between echoes returned from the sample and representative reference signals of the bursts supplied to the sample until a spectrum of the phase differences versus frequency is obtained and from which properties of the adhesion at an interface reflecting the echoes are derivable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.