Current sensor integrated circuits

US11519939B2 · kind B2 · utility

Assignee

• Allegro MicroSystems, LLC · US

Inventors

• Shixi Louis Liu · Milpitas, US
• Paul A. David · Bow, US
• Shaun D. Milano · Dunbarton, US
• Rishikesh Nikam · Manchester, US
• Alexander Latham · Harvard, US
• Wade Bussing · Manchester, US
• Natasha Healey · Manchester, US
• Georges El Bacha · Manchester, US

Key dates

• Filing date: Sep 13, 2021
• Grant date: Dec 6, 2022
• Expiry date: Sep 13, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.