Packaged current sensor integrated circuit
US11519946B1 · kind B1 · utility
6Cited by
18References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Aug 23, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R19/16571
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.