Three-dimensional sensing module and method of manufacturing the same and electronic apparatus
US11520429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04106
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A three-dimensional sensing module includes a touch pressure sensing structure. The touch pressure sensing structure includes a first functional spacer layer, a first light-transmitting electrode layer coated on the first functional spacer layer, a second functional spacer layer coated on the first light-transmitting electrode layer, a second light-transmitting electrode layer coated on the second functional spacer layer, and a third functional spacer layer coated on the second light-transmitting electrode layer. Resistivities of the first, second, and third functional spacer layers are greater than resistivities of the first and second light-transmitting electrode layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.