Semiconductor device
US11521661B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 30, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided, which includes a memory chip and a temperature detection module. The temperature detection module is configured to detect a temperature of the memory chip. The temperature detection module includes a temperature detection unit. The temperature detection unit includes a temperature sensitive unit and an adjustable resistor unit. An electrical conductivity of the temperature sensitive unit changes with the change of temperature, and the adjustable resistor unit being connected in parallel with the temperature sensitive unit. The temperature detection unit is configured to be calibrated by adjusting a resistance value of the adjustable resistor unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.