Patent · US Active

High density coil design and process

US11521785B2 · kind B2 · utility

2Cited by

23References

19Claims

0Family size

Assignee

Hutchinson Technology Incorporated · US

Inventors

John L. Schumann · Litchfield, US
Nole D. German · Hutchinson, US
Trent A. Johnson · Hutchinson, US
Duane M. Jelkin · Hutchinson, US
Matthew S. Lang · Excelsior, US
Ryan N. Ruzicka · Dassel, US
Forrest A. Cravens · Hutchinson, US
Todd A. Peter · Darwin, US
Zachary A. Pokornowski · Cokato, US

Key dates

Filing date	Nov 22, 2019
Grant date	Dec 6, 2022
Priority date	—
Expiry date	Nov 22, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.