Patent · US Active

Conformable heat sink pedestal for multi-chip packages

US11521911B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Eng Kwong Lee · Merang, MY
Tung Lun Loo · Bukit Mertajam, MY

Key dates

Filing date	Nov 9, 2020
Grant date	Dec 6, 2022
Priority date	—
Expiry date	Jun 4, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/3736
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure relates to a heat sink pedestal including a composite material. The composite material may include at least one layer of a thermally conductive primary material and at least one layer of a thermally conductive secondary material. The composite material may include a conductivity ratio of lateral thermal conductivity (Kz) to planar thermal conductivity (Kx, Ky) of the composite material of at least 0. The heat sink pedestal may be conformable to a shape of a semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.