Package structure
US11522108B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 15, 2022 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Feb 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
Abstract
A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.