Light emitting package structure and method of manufacturing the same
US11522109B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2019 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Nov 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
Abstract
A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.