Cooling profile integration for embedded power systems
US11523496B2 · kind B2 · utility
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2References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 19, 2021 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Feb 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.