Method for fabrication of a soft-matter printed circuit board
US11523514B2 · kind B2 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2020 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Jun 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication process for soft-matter printed circuit boards is disclosed in which traces of liquid-phase Ga—In eutectic (eGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically-aligned columns of eGaIn-coated ferromagnetic microspheres that are embedded within an interfacial elastomer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.