Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
US11524897B2 · kind B2 · utility
0Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Jul 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr1-xCax)m(Ti1-yHfy)O3-δNδ, in which 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, 0<δ≤0.05 are satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.