Formation of pores in atomically thin layers
US11524898B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 3, 2017 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | May 10, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Atomically thin layers including pores, their method of manufacture, and their use are disclosed. In some embodiments, pores may be formed in an atomically thin layer by growing the atomically thin layer on exposed portions of a substrate that includes islands comprising a material that is different than the material of the substrate. In some embodiments, pores and/or defects may be formed in an atomically thin layer by employing growth conditions that promote the formation of defects and/or pores. In certain embodiments, pores and/or defects may be etched to enlarge their size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.