Patent · US Active

Formation of pores in atomically thin layers

US11524898B2 · kind B2 · utility

1Cited by
5References
27Claims
0Family size

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Key dates

Filing dateNov 3, 2017
Grant dateDec 13, 2022
Priority date
Expiry dateMay 10, 2039

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/56
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

Atomically thin layers including pores, their method of manufacture, and their use are disclosed. In some embodiments, pores may be formed in an atomically thin layer by growing the atomically thin layer on exposed portions of a substrate that includes islands comprising a material that is different than the material of the substrate. In some embodiments, pores and/or defects may be formed in an atomically thin layer by employing growth conditions that promote the formation of defects and/or pores. In certain embodiments, pores and/or defects may be etched to enlarge their size.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.