Polishing composition based on mixture of colloidal silica particles
US11525071B2 · kind B2 · utility
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20Claims
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Inventor
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Feb 27, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided herein are compositions comprising a first colloidal silica particle that is not surface-modified and a second colloidal silica particle that is surface modified to carry a negative charge. Also provided herein are methods for selectively removing HfO2 or SiO2 from a surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.