Temperature monitoring for printed circuit board assemblies during mass soldering
US11525736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Apr 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/083
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.