Form analysis system
US11527109B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Jan 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W88/085
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for monitoring and measuring form. A form analysis system can include a flexible garment, a sensor array including two or more sensors positioned on portions of the garment such that at least two of the two or more sensors are positioned on garment such that they align with body parts of the wearer of the garment that are separated by a joint, a harness coupled to the sensor array, the harness having stretchable wiring for communicating signals generated by the sensor array, and a hub coupled to the harness and configured to receive signals from the sensor array, the hub including a transmitter to transmit received signals to a base station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.