Electronic component, electronic-component mounting board, and electronic-component manufacturing method
US11527352B2 · kind B2 · utility
0Cited by
2References
23Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 2, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Apr 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.