Busbar with tailored perforation sizes to provide thermal path
US11527357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is an assembly including a busbar that includes: a first layer that defines: first layer top and bottom surfaces; first layer first and second ends; and a first layer center region between the first layer first and second ends; and the first layer forms first layer perforations of different sizes about the first layer center region so perforations closer to the first layer first end are smaller than perforations spaced apart therefrom; a second layer that is disposed against and electrically isolated from the first layer bottom surface, wherein the second layer defines connector orifices having a same size as each other that are aligned with the first layer perforations; and a first capacitor supported against and electrically connected to the first layer top surface, wherein the first capacitor includes busbar connectors that respectively extend through the first layer perforations to electrically connect with the connector orifices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.