Semiconductor package and method for manufacturing the same
US11527488B2 · kind B2 · utility
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1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2021 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Apr 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a magnetic layer including an inner portion having a predetermined area and an outer portion disposed outward of the inner portion, a lower polymer layer disposed below the magnetic layer, and a dicing surface formed by ends of the magnetic layer and the lower polymer layer and extending along a stacked direction of the magnetic layer and the lower polymer layer. At least a part of the outer portion of the magnetic layer includes an inclined surface inclined downward in the stacked direction, and has a thickness greater than a thickness of the inner portion in the stacked direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.