Semiconductor device package
US11527681B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 31, 2019 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Aug 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
Abstract
Disclosed in an embodiment is a semiconductor device package comprising: a body comprising a cavity; a semiconductor device disposed within the cavity; and a light transmission member disposed on an upper portion of the cavity, wherein the body comprises a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part, and a second insulating part disclosed in an edge region where a lower surface and side surfaces of the body meet, wherein the cavity comprises a stepped portion on which the light transmission member is disposed, and wherein the second insulating part overlaps with the stepped portion in a vertical direction of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.