Overall efficient heat dissipation system for high power density cabinet
US11528829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Dec 13, 2022 |
| Priority date | — |
| Expiry date | Jun 30, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An overall efficient heat dissipation system for a high power density cabinet comprises a pump-driven two-phase circulation loop high-power-chip direct heat dissipation system and a cabinet air-cooling system. The cabinet air-cooling system comprises a refrigerant circulation loop and a cabinet internal air circulation loop. The refrigerant circulation loop includes a pump-driven two-phase circulation loop and a vapor compression circulation loop. The pump-driven two-phase circulation loop high-power-chip direct heat dissipation system performs fixed-point heat dissipation for main heating elements, such as CPU and GPU, in a server, and the cabinet air-cooling system performs air-cooling heat dissipation for other heating elements in the server.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.