Patent · US Active

Co-packaging with silicon photonics hybrid planar lightwave circuit

US11531174B2 · kind B2 · utility

3Cited by

2References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sang Yup Kim · Sunnyvale, US
Myung Jin Yim · San Jose, US
Woosung Kim · Mountain View, US

Key dates

Filing date	Sep 28, 2017
Grant date	Dec 20, 2022
Priority date	—
Expiry date	Sep 28, 2037

Classification

Technology area (CPC G)Physics
CPC primaryG02B2006/12061
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.