Method for fabricating semiconductor chip by using multi-curing apparatus and multi-curing apparatus
US11532328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2019 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Oct 20, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/067
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-curing apparatus includes an actuator, a first chamber including a first energy source head, a second chamber including a second energy source head, a first driver including a first rotation transmission gear gear-engaged with the actuator, and a first driving gear gear-engaged with the first chamber. The apparatus further includes a second driver including a second rotation transmission gear gear-engaged with the actuator, and a second driving gear gear-engaged with the second chamber. The apparatus aligns a position of the first chamber with reference to a position of the second chamber while the first rotation transmission gear, the second rotation transmission gear, and the second driving gear are fixed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.