Multilayer electronic component and method for manufacturing multilayer electronic component
US11532438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2020 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Dec 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/248
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.