Double-sided hermetic multichip module
US11532526B2 · kind B2 · utility
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14Claims
0Family size
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Key dates
| Filing date | Feb 3, 2017 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Feb 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged electronic module for downhole applications, in particular in a petrochemical well or similar environment. The electronic module includes one or more electronic components located on each side of a substrate, where the one or more electronic components are attached to the substrate by means of glue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.