Encapsulant of a photovoltaic module
US11532764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2015 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Jun 8, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An encapsulant of a photovoltaic module, intended for coating a photovoltaic cell, having a composition which does not include any cross-linking agent and including: an ethylene—alkyl acrylate copolymer, the copolymer making up 70% to 96% of the weight of the composition; a silane, making up 0.1% to 2% of the weight of the composition; wherein the composition also includes a terpolymer of ethylene—acrylic ester—maleic anhydride or glycidyl methacrylate, the terpolymer making up 2% to 29.9% of the weight of the composition. Also relates to the use of such an encapsulant in a photovoltaic module as well as to a photovoltaic module including such an encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.