Semiconductor device package
US11532771B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 12, 2019 |
| Grant date | Dec 20, 2022 |
| Priority date | — |
| Expiry date | Dec 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8516
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.