Polishing pad for wafer polishing apparatus and manufacturing method therefor
US11534889B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2018 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.