Patent · US Active

High temperature 3D printing via inverted heated build chamber

US11534970B2 · kind B2 · utility

0Cited by
1References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 12, 2019
Grant dateDec 27, 2022
Priority date—
Expiry dateSep 22, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB33Y40/00
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Described herein are 3D printers capable of printing high-performance materials and uses thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.