Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system
US11535699B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
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Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Sep 9, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.