Solvent free vinyl plastisol composition
US11535769B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a heat curable solvent free plastisol composition that exhibits very low volatile organic compound amounts while maintaining high performance characteristics. The present plastisol compositions have solvent substitutes used at amounts up to 15% by weight based on the total composition weight. The solvent substitutes have very low vapor pressures, stable viscosity effects, and are fusible with the plastisol polymers. These solvent substitutes can be used to replace the typical solvents without requiring extensive re-formulation of the plastisol composition. The final plastisol compositions according to the present invention exhibit low VOC measures of less than 0.03 pounds per gallon when measured according to EPA Method 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.