Digital pressure sensor with rubber cover
US11536623B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 30, 2020 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Apr 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L2019/0053
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A digital pressure sensor includes a substrate, a pressure sensing structure configured for measuring a pressure of an object to be measured, a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, and a rubber cover having an opening through which the pressure is sensed. The pressure sensing structure and the signal processing chip are mounted on the substrate. The signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal. The signal processing chip is electrically connected to the substrate. The substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.