Multi-chip photonic quantum computer assembly with optical backplane interposer

US11536897B1 · kind B1 · utility

Assignee

• PsiQuantum Corp. · US

Inventors

• Mark Thompson · Palo Alto, US
• Gabriel J. Mendoza · San Francisco, US

Key dates

• Filing date: Feb 1, 2021
• Grant date: Dec 27, 2022
• Expiry date: Feb 1, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12107
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.