Fingerprint sensor with differently sized sensing structures
US11538267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2021 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/236
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor comprising a plurality of electrically conductive sensing structures arranged in a sensing plane for capacitively sensing a fingerprint of a finger placed on the finger receiving surface of the fingerprint sensor arrangement, the plurality of electrically conductive sensing structures including: a first set of electrically conductive sensing structures, each sensing structure in the first set of electrically conductive sensing structures covering an area in the sensing plane being within a first area range; and a second set of electrically conductive sensing structures, each sensing structure in the second set of electrically conductive sensing structures covering an area in the sensing plane being within a second area range only including areas greater than the areas within the first area range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.