Fingerprint sensor package and smartcard including the same
US11538268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2021 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Oct 13, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1329
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.