Display device having a heat dissipation layer with a gap separation portion and manufacturing method thereof
US11538800B2 · kind B2 · utility
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1References
20Claims
0Family size
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Key dates
| Filing date | Feb 20, 2019 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Jan 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A display device and a manufacturing method thereof are provided. The display device includes a display panel, a heat dissipation layer, and a chip on film. The heat dissipation layer is on a non-display side of the display panel and includes a driving circuit arranging region and a peripheral region. The heat dissipation layer located in at least a part of the driving circuit arranging region is insulated from the heat dissipation layer located in the peripheral region. The chip on film is on a side of the heat dissipation layer away from the display panel and is in the driving circuit arranging region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.