Display substrate having bonding area for bonding with circuit structure, display apparatus, and circuit structure having bonding area for bonding with display substrate
US11538833B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 6, 2018 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Oct 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A display substrate having a bonding area for bonding with a circuit structure. The display substrate includes a plurality of first electrodes and a plurality of second electrodes in the bonding area, a respective one of the plurality of first electrodes being bound to a respective one of the plurality of second electrodes thereby forming a respective pair of a plurality of bound electrode pairs in the bonding area; a barrier layer including a plurality of barriers respectively between adjacent pairs of the plurality of bound electrode pairs; and an anisotropic conductive film for bonding the respective one of the plurality of first electrodes and the respective one of the plurality of second electrodes together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.