Array substrate with dummy lead including disconnected conducting wires, method for manufacturing the same, display panel and display device
US11538835B2 · kind B2 · utility
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Key dates
| Filing date | Jan 2, 2019 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Aug 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/441
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The disclosure discloses an array substrate, a method for manufacturing the same, a display panel and a display device. The array substrate includes a base substrate; a plurality of data lines and a plurality of dummy leads, wherein the plurality of data lines and the plurality of dummy leads are in the same layer on the base substrate, and the plurality of data lines and the plurality of dummy leads extend along the first direction; and at least one dummy lead includes a plurality of wires which extend in the first direction and are disconnected with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.