Fingerprint identification substrate and manufacturing method therefor, identification method and display apparatus
US11538848B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 26, 2021 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Jun 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/65
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.