Patent · US Active

Circuit arrangement consisting of two interconnected high-frequency components

US11539151B2 · kind B2 · utility

0Cited by

23References

14Claims

0Family size

Assignee

Tesat-Spacecom GmbH & Co. KG · DE

Inventors

Christian Arnold · Kehl, DE
Tobias Kässer · Backnang, DE
Michael Franz · Backnang, DE
Tobias Janocha · Backnang, DE
Andre Berger · Backnang, DE
Ralf Kröner · Backnang, DE
Ulrich Mahr · Backnang, DE
Benjamin Falk · Backnang, DE

Key dates

Filing date	Jun 22, 2020
Grant date	Dec 27, 2022
Priority date	—
Expiry date	Mar 12, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01R2103/00
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A circuit arrangement having two interconnected high-frequency components, namely a first component and a second component, is described. A connection for transferring high-frequency signals is arranged between the first component and the second component. The connection includes at least one inner conductor, which is at least partially enclosed by an outer conductor. The inner conductor is connected to the first component and to the second component in order to transfer high-frequency signals. The second component includes a contact surface on a connecting surface and the inner conductor is pressed using a pressure force onto the contact surface, to establish a high-frequency connection between the first component and the second component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.