Methods of making printed structures
US11540398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2022 |
| Grant date | Dec 27, 2022 |
| Priority date | — |
| Expiry date | Mar 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.