Headboard, bed and packaging method
US11540641B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2022 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Mar 9, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B35/50
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A headboard provided by embodiments of the present disclosure is formed by detachably combining a first headboard, a second headboard, a third headboard, and a fourth headboard, and backs of the first headboard, the second headboard, the third headboard, and the fourth headboard are respectively provided with accommodating grooves. When the bed needs to be packaged and shipped, the headboard can be disassembled into the first headboard, the second headboard, the third headboard, and the fourth headboard, and other parts of the bed, including the left headboard and the right headboard, are placed into a space enclosed by the accommodating grooves of the lower headboard and the upper headboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.