Method of producing glass substrate having hole and glass laminate for annealing
US11541482B2 · kind B2 · utility
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Key dates
| Filing date | Oct 22, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | May 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.