Molded printhead
US11541659B2 · kind B2 · utility
0Cited by
93References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2020 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.