Z-CNT filled meltable adhesives for bonding of deicers
US11542019B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Jun 11, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of making an adhesive for an ice protection assembly includes transferring Z-CNTs from a substrate carrier into the adhesive. De-bonding of the adhesive for ice protection assembly inspection or repair or repositioning at initial installation includes heating the Z-CNTs in the adhesive to soften the adhesive and allow for easy removal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.