Curable heat-seal adhesives for bonding polymers
US11542354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Mar 16, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2477/006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable compositions include a urethane (meth)acrylate oligomer having a number—average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers, methacrylate monomers, or combinations thereof; and an ethylene-vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50° C. and 175° C. and a second mono(meth)acrylate with Tg between −50° C. and 30° C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation, UV radiation, LED radiation, laser radiation, electron-beam radiation, peroxide, accelerator, or heat. Methods for bonding substrates include contacting a second substrate to a tow-tack adhesive layer on a first substrate, then heating the low-tack adhesive layer to bond the substrates and form a laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.