Bendable circuit board, expandable circuit board, and electronic device made therefrom
US11542377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2019 |
| Grant date | Jan 3, 2023 |
| Priority date | — |
| Expiry date | Dec 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ρ/ρ0 of the specific electrical resistance ρ of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (Ω·cm) ρ0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.